Wafer-scale transfer of 2D materials by bonding–debonding. a, Schematic illustration of the bonding and debonding process. b, ...

Learn how Bruker’s InSight systems ensure pristine wafer surfaces, improving bond integrity and yield in advanced semiconductor packaging.

A key objective of electronics engineers is to further reduce the size of devices, while also boosting their speed, ...

3M is committed to advancing the semiconductor industry through materials innovation. By enabling efficiency, improving reliability, and supporting environmental goals, we help manufacturers meet the ...

Chinese researchers develop a direct wafer bonding method for 2D semiconductors, enabling smaller, faster electronics.

According to a recent analysis by Towards Packaging, the global semiconductor assembly packaging equipment market is ...

High-bandwidth memory stands at the forefront of multiple technology developments as a critical enabler of AI, but it is one of the most difficult modules to manufacture. Leading HBM device makers and ...

ASMPT has secured orders for 19 Chip-to-Substrate thermo-compression bonding tools from a major outsourced semiconductor ...

ASMPT Wins New Orders for Nineteen Chip-to-Substrate TCB Tools to Serve AI Chip MarketASMPT (HKEX: 0522), the world’s ...

The use of glass in semiconductors will nearly triple by 2030, driven by CIS, microfluidics, power, memory/HBM, RF, and AR applications, says Yole Group. Glass wafer revenues are expected to grow with ...

France's Yole Group examines the growing adoption of glass as a critical enabler for semiconductor manufacturing, redefining ...