GRENOBLE, France--(BUSINESS WIRE)--Hprobe, a provider of turnkey semiconductor Automatic Test Equipment (ATE) for magnetic devices, today announced a breakthrough magnetic test head revolutionizing ...
Wafer sorting is usually regarded as the most critical stage in the whole wafer probing process. This paper discusses the wafer sorting scheduling problem (WSSP) with total setup time minimization as ...
SINGAPORE–Singapore's United Test and Assembly Center Ltd. (UTAC) here today announced the grand opening of what the company claims is Southeast Asia's first 300-mm wafer sorting facility. UTAC, a ...
TOKYO, Dec. 07, 2023 (GLOBE NEWSWIRE) -- Leading semiconductor test equipment supplier Advantest Corporation (TSE: 6857) today announced three new additions to its suite of memory test products. The ...
Let us help you with your inquiries, brochures and pricing requirements Request A Quote Download PDF Copy Download Brochure Wafer XRD 200 stands as an ultra-fast ...
May 19, 2011, 4:17 PM EDT / Source: GlobeNewswire FREMONT, Calif., May 19, 2011 (GLOBE NEWSWIRE) -- Aehr Test Systems (Nasdaq:AEHR), a worldwide supplier of semiconductor test and burn-in equipment, ...
MANHASSET, N.Y. — Singapore-based semiconductor test and packaging services supplier STATS ChipPAC has announced it will open a 200-mm wafer bumping operation in China specializing in gold bump ...
One of the defining challenges of advanced packaging lies in maintaining traceability as dies move through multiple ...
Test strategy analysis has become increasingly important for finding ways to reduce test costs for system-on-a-chip (SoC) semiconductor devices. Every SoC device’s test flow is unique and requires a ...
Not all chips are created equal, and this is viewed as both a blessing and a curse by semiconductor makers. On one hand, chips can be screened for certain attributes, and some of the chips can be sold ...
Inari Amertron Bhd. is an investment holding company, which through its subsidiaries provides OSAT niche services in Radio Frequency System in Package for smart mobile devices, fiber-optic transceiver ...
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