New Delhi, May 20, 2024 (GLOBE NEWSWIRE) -- The global wafer dicing services market stood at US$ 578.8 million in 2023. It is expected to reach US$ 838.9 million by 2032, growing at a moderate CAGR of ...

ORLANDO, Fla., September 27, 2024--(BUSINESS WIRE)--Fonon, a multi-market holding company, R&D center, equipment designer and manufacturer of advanced laser material processing systems for subtractive ...

Global wafer dicing services market was valued at US$ 578.8 million in 2023 and is projected to exceed valuation of US$ 838.9 million by 2032 at a CAGR of 4.21% during the forecast period 2024–2032.

(MENAFN- EIN Presswire) Rest of Asia-Pacific segment contributed the major share in the thin wafer processing and dicing equipment market in 2021. The thin wafer processing and dicing equipment market ...

LONDON--(BUSINESS WIRE)--The wafer dicing saws market will witness an incremental growth of USD 95.94 million during 2020-2024, according to the latest pandemic recovery-based research report by ...

A major driver of growth in the protective film market is the burgeoning demand for high-performance semiconductors, particularly in the fields of consumer electronics and automotive technology. With ...

LONDON--(BUSINESS WIRE)--The global wafer dicing saws market size is poised to grow by USD 95.94 million during 2020-2024, progressing at a CAGR of almost 3% throughout the forecast period, according ...

Dublin-based equipment maker Xsil today said it is ready to ship a fully automated laser-dicing tool for thin wafers that it says works without chipping or cracking. Once upon a time within the ...

Synova SA is poised to revolutionize wafer dicing with its innovative laser-microjet (LMJ) technology, where a hair-thin low-pressure jet of water guides the laser while simultaneously absorbing heat ...

The "Global Wafer Dicing Saws Market 2017-2021" report has been added to Research and Markets' offering. The global wafer dicing saws market to grow at a CAGR of 6.35% during the period 2017-2021.