IC packaging is a technique for shielding semiconductor equipment from ambient physical damage or degradation by wrapping them in ceramics or polymer packaging materials. There are several varieties ...

A new technical paper titled “Warpage Study by Employing an Advanced Simulation Methodology for Assessing Chip Package Interaction Effects” was published by researchers at Siemens EDA, D2S, and Univ.

Milpitas, Calif. – When interfaced with a microcontroller, Linear Technology Corp.'s LTC4008, a 4-amp multicell, multichemistry battery pack charger IC, is said to be capable of charging nickel ...

My previous four columns examine thermistors, RTDs(resistance-temperature detectors), and thermocoupletemperature sensors (references 1 through 4). The integratedtemperature sensors on the market can ...

Rising demand for chips is hitting the IC packaging supply chain, causing shortages of select manufacturing capacity, various package types, leadframes and even some equipment. Spot shortages for some ...