According to a recent analysis by Towards Packaging, the global semiconductor assembly packaging equipment market is projected to expand from USD 5.35 billion in 2026 to USD 11.11 billion by 2034, ...

SINGAPORE, SG / ACCESS Newswire / November 25, 2025 / Dr. Byung Joon Han, co-founder and CEO of Silicon Box attended the ...

A new technical paper titled “A color-coded light-induced heating technology for Pb-free solder joints of advanced ...

CNW/ - Today, Carlos Leitão, Parliamentary Secretary to the Minister of Industry and Member of Parliament for Marc-Aurèle-Fortin on behalf of the Honourable Mélanie Joly, Minister of Industry and ...

Arteris, Inc. has announced the launch of Magillem Packaging, a new software aimed at simplifying and accelerating the chip design process, particularly for advanced technologies in AI and edge ...

CEASAX advances European semiconductor innovation through integrated front-end and advanced packaging research.

2.5D and 3D Packaging Technology: The 2.5D and 3D packaging technologies encompass various packaging techniques. In 2.5D packaging, the choice of interposer material categorizes it into Si-based, ...

Izmo has outlined a "dual-engine" expansion strategy that uses its profitable automotive SaaS and digital businesses to fund ...

ST. PAUL, Minn., Sept. 30, 2025 /PRNewswire/ -- 3M has joined the next-generation semiconductor packaging consortium JOINT3, an effort to bring together global leaders in semiconductor materials, ...

TEMPE, Ariz.--(BUSINESS WIRE)-- Amkor Technology, Inc. (Nasdaq: AMKR), a leading provider of semiconductor packaging and test services, in collaboration with the Trump Administration, today announces ...