Flip chip packaging represents a cutting‐edge assembly technique in which semiconductor devices are mounted upside‐down, enabling direct connection to the substrate via solder bumps. This method not ...
New York, Aug. 24, 2020 (GLOBE NEWSWIRE) -- Reportlinker.com announces the release of the report "Global Flip Chip Market By Packaging Technology, By Bumping Technology, By End User, By Region, ...
DUBLIN--(BUSINESS WIRE)--The "Flip Chip/WLP Manufacturing and Market Analysis" report has been added to Research and Markets' offering. The Number of Packages Utilizing WLP Will Equal Flip Chip ...
TORONTO, Dec. 17, 2020 (GLOBE NEWSWIRE) -- POET Technologies Inc. (“POET” or the “Company”) (TSX Venture: PTK; OTCQX: POETF) the designer and developer of the POET Optical Interposer™ and Photonic ...
The latest addition to its Narrow Pixel Pitch (NPP) product family brings tighter pixel spacings with increased durability. When you purchase through links on our site, we may earn an affiliate ...
Some results have been hidden because they may be inaccessible to you
Show inaccessible results
Feedback