QPT just filed a patent for the “qAttach” process, a novel way to attach dies to heat spreaders or substrates (typically aluminum nitride (AlN)) that significantly reduces thermal resistance. The new ...
MANHASSET, N.Y. — A tiny California startup hopes that its recent deal with giant Infineon Technologies AG will catapult its unique chip-attach departure — which substitutes springs for solder — into ...
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QPT Solves Major Problem of Waste Heat Removal in Power Electronics with Novel Die Attach Process
The power electronics industry is facing a problem in that, as the power handled by transistors increases to meet the needs of new applications, the packaging will increasingly struggle to remove the ...
Die attach materials form the cornerstone of reliable power electronic packaging, providing the essential bond between semiconductor devices and their substrates. Recent advances have focused on ...
Shibuya-ku, Tokyo, Japan, Japan, Jul 14, 2022, 07:23 /Comserve / -- Die Attach Equipment Market size, share, growth, trends, segmentation, top key players, strategies ...
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