Die attach materials form the cornerstone of reliable power electronic packaging, providing the essential bond between semiconductor devices and their substrates. Recent advances have focused on ...
The power electronics industry is facing a problem in that, as the power handled by transistors increases to meet the needs of new applications, the packaging will increasingly struggle to remove the ...
As the demand for high-performance power semiconductors continues to escalate across automotive and industrial sectors, Henkel is addressing one of the industry's most pressing challenges: thermal ...
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Within this presentation I give a short technology overview of state-of-the-art die attach and substrate technologies applicable to different power electronics for hybridization and full electric ...
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