HSINCHU, Taiwan, Sept. 20, 2018 /PRNewswire/ -- Amid over demand from power management components (MOSFET) in booming smart car markets, and addressing the heavy shortage of this segment in supply ...
SAN JOSE, Calif. – Corwil Technology Corp., a provider of contract assembly and wafer dicing services, today announced the acquisition of Disco Hi-Tec America's wafer thinning and polishing equipment ...
FREMONT, Calif. — ChipPAC Inc. here today announced it has qualified all the frontend assembly steps needed for the packaging of ICs from 300-mm diameter wafers, including new processes that will thin ...
FREMONT, Calif., Sept. 15, 2020 (GLOBE NEWSWIRE) -- ACM Research, Inc. (NASDAQ: ACMR), a leading supplier of wafer-processing solutions for semiconductor and advanced wafer-level packaging (WLP) ...
3M is committed to advancing the semiconductor industry through materials innovation. By enabling efficiency, improving reliability, and supporting environmental goals, we help manufacturers meet the ...
Materials science likes to take nature and the special properties of living beings that could potentially be transferred to materials as a model. A research team has succeeded in endowing materials ...
A research team develops an assembly method for atomically thin crystals at the wafer-scale. Lego blocks, beloved by both children and adults, can be assembled into set models like space shuttles or ...
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