With a thickness of only 20 µm and a diameter of 300 mm, Infineon’s silicon power wafers are the thinnest in the industry. These ultra-thin wafers are a quarter the thickness of a human hair and half ...
BEIJING, Aug. 31, 2023 /PRNewswire/ -- WiMi Hologram Cloud Inc. (NASDAQ: WIMI) ("WiMi" or the "Company"), a leading global Hologram Augmented Reality ("AR") Technology provider, today announced that ...
(RTTNews) - German semiconductor maker Infineon Technologies AG (IFNNY) announced Wednesday the development of the world's first 300 mm power gallium nitride or GaN wafer technology. The ...
Chip startup Graphcore Ltd. today introduced a new artificial intelligence processor, the Bow IPU, that uses an innovation dubbed wafer-on-wafer technology to speed up calculations. U.K.-based ...
OKI (TOKYO: 6703) has successfully developed Tiling crystal film bonding (CFB; Note 1) technology using its proprietary CFB technology. This technology makes possible the heterogeneous integration of ...
ASM Lithography Holding NV (ASML) today unveiled its dual wafer stage technology for new i-line and deep UV imaging systems at Semicon Japan, being held this week in Tokyo. The technology is the first ...
BEDFORD, Mass. & SEOUL, South Korea--(BUSINESS WIRE)--Silicon wafer manufacturer 1366 Technologies together with its strategic partners, Hanwha Q CELLS Malaysia Sdn. Bhd. and parent company Hanwha Q ...
The global market for Military Grade 12-inch Silicon Wafer was valued at USD 5552 Million in the year 2024 and is projected to reach a revised size of USD 8355 Million by 2031, growing at a CAGR of ...
A research team led by Prof. Hu Weijin from the Institute of Metal Research (IMR) of the Chinese Academy of Sciences (CAS), ...
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