– SCHMID accompanies production change-over and takes care of downstream processes. The wafers of the future are getting thinner and thinner and already approaching a thickness of 140 µm. The slurry ...

Diamond wire sawing is a critical cutting technology in the semiconductor and photovoltaic industries, employed to slice single-crystal silicon ingots into thin wafers. The process utilises a ...

The German tooling firm announces the development of a new texturing process for multicrystalline wafers using diamond wire sawing on its LINEX inline system. Company believes process can boost multi ...

Swindon-based Loadpoint is to develop techniques and equipment for manufacturing next-generation 0.10micron integrated circuits. “We are looking at the requirements of dicing chip-scale packages from ...

The complete wafer saw solution includes: DISCO’s fully automatic dicing saw for high-throughput, dual-cut processing, DISCO’s ablation laser saw and stealth dicing saw, Rudolph’s NSX ® inspection ...

Silicon wafer market saw positive growth in 2002News from E-InSitePulling the industry into positive growth, worldwide silicon wafer revenue totaled $5.7bn in 2002, an increase of 5.2 per cent from ...

Inari Amertron Bhd. is an investment holding company, which through its subsidiaries provides OSAT niche services in Radio Frequency System in Package for smart mobile devices, fiber-optic transceiver ...

Today, most solar cells are made with a process that turns almost half of the raw material—highly refined and processed crystalline silicon—into sawdust. A new process developed by startup Astrowatt ...

Some customers would buy wafers directly from Nexperia’s Hamburg factory and handle separate transport to China.

NexWafe’s high-throughput epitaxy tool, ProCon 2.5. Image: NexWafe German solar wafer manufacturer NexWafe has announced “key milestones” in its epitaxial wafer production which it claims can reshape ...