Charlotte, N.C., Feb. 01, 2021 (GLOBE NEWSWIRE) -- Akoustis Technologies, Inc. (NASDAQ: AKTS) (“Akoustis” or the “Company”), an integrated device manufacturer (IDM) of patented bulk acoustic wave (BAW ...
From rapid prototyping to full production, the modular and scalable XbloX platform is said to help SiC device developers to ...
How a real chip-last process flow with a chip-to-wafer (C2W) bonding technology can address the RDL-base Interposer PoP challenge. Fan-Out Wafer-Level Interposer Package-on Package (PoP) design has ...
Imec has developed a Cu-to-Cu and SiCN-to-SiCN die-to-wafer bonding process resulting in a Cu bond pad pitch of only 2µm at <350nm die-to-wafer overlay error, achieving good electrical yield. Such ...
Unpatterned wafer inspection, which has flown well under the radar for most of the semiconductor industry, is becoming more critical amid the need to find defects earlier in the manufacturing process ...
BILLERICA, Mass.--(BUSINESS WIRE)--July 10, 2006--NEXX Systems, a leading provider of processing equipment for advanced wafer level packaging applications, is pleased to introduce the Stratus 200 and ...
Aimed at prototyping single- or multi-chip verifications or small volume production runs, Hsinchu, Taiwan-based wafer foundry Taiwan Semiconductor Manufacturing Co. Inc. (TSMC) today launched what it ...
The first WLCSP device is expected to be technology qualified later this quarter with production release expected in the June 2021 quarter. The new package offers a significantly smaller filter ...
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