Tech Xplore on MSN

Direct approach can bond and debond 2D semiconductors without any glue-like materials

A key objective of electronics engineers is to further reduce the size of devices, while also boosting their speed, ...
Electronics For You

2D Wafer Bonding For Smaller Electronics

Wafer-scale transfer of 2D materials by bonding–debonding. a, Schematic illustration of the bonding and debonding process. b, ...
The Victoria Advocate

EV Group Advances 300-mm MEMS Manufacturing with Next-Generation GEMINI® Automated Production Wafer Bonding System

ST. FLORIAN, Austria, March 18, 2025 /PRNewswire/ -- EV Group (EVG), a leading provider of innovative process solutions and expertise serving leading-edge and future semiconductor designs and chip ...
PR Newswire

Semiconductor Wafer Bonding Materials Market to Reach $400.17 Million by 2031, Driven by Packaging Advancements | Valuates Reports

BANGALORE, India, May 16, 2025 /PRNewswire/ -- The Global Temporary Wafer Bonding Materials Market is Segmented by Type (Thermoplastic Materials, UV Curing Materials, Composite Films, Metallic ...
Business Wire

Invensas to Exhibit Low Temperature Wafer Bonding and 3D Interconnect Solutions at IWLPC 2016

SAN JOSE, Calif.--(BUSINESS WIRE)--Tessera Technologies, Inc. (Nasdaq:TSRA), announced today that its wholly owned subsidiary Invensas Corporation will exhibit its low temperature wafer bonding and 3D ...
Business Wire

3M Adds Temporary Wafer Bonding Application Lab in Taiwan

ST. PAUL, Minn.--(BUSINESS WIRE)--3M, a leading supplier of advanced materials to the semiconductor packaging industry, today announced the opening of the company’s application laboratory in Yangmei, ...

Shaping Tomorrow’s Microchips: 3M Materials-Science Innovations in Semiconductor Manufacturing

3M is committed to advancing the semiconductor industry through materials innovation. By enabling efficiency, improving reliability, and supporting environmental goals, we help manufacturers meet the ...
EDN

EV Group Clears Key Barriers To 3D-IC/TSV High-Volume Manufacturing With Breakthrough Fusion Wafer Bonding Solution

Wafer-to-wafer bonding is an essential process step to enable 3D devices such as stacked DRAM, memory-on-logic and future CMOS image sensors. At the same time, minimizing the dimensions of TSVs, which ...
Yahoo Finance

OKI Develops Tiling crystal film bonding (CFB) Technology for Heterogeneous Integration of Optical Semiconductors onto 300 mm Silicon Wafers

TOKYO, August 14, 2025--(BUSINESS WIRE)--OKI (TOKYO: 6703) has successfully developed Tiling crystal film bonding (CFB; Note 1) technology using its proprietary CFB technology. This technology makes ...
EDN

Brewer Science Releases a High-Temperature Ultrathin Wafer Handling Solution, WaferBOND™ HT-10.10 Coating

Brewer Science, Inc., announces the release of its second generation of spin-on polymeric temporary wafer bonding materials with superior bonded pair thermal stability. The Brewer Science WaferBOND™ ...
Semiconductor Engineering

Gearing Up For Hybrid Bonding

Hybrid bonding is becoming the preferred approach to making heterogeneous integration work, as the semiconductor industry shifts its focus from 2D scaling to 3D scaling. By stacking chiplets ...