Thermal challenges in 3D-IC designs can cause a significant risk in meeting performance specifications. While the pace of Moore’s Law has slowed in recent years, system technology co-optimization ...

Managing thermal and mechanical stress in multi-die assemblies will require a detailed knowledge of how and where a device will be used, how it will be packaged, and where stresses could cause ...

Hybrid, 3D integrated optical transceiver. (A,B) The test setup: the photonic chip (PIC) is placed on a circuit board (green), and the electronic chip (EIC) is bonded on top of the photonic chip. (C) ...

Recent advancements in AI and more specifically large language models such as ChatGPT have put a strain on data centers. AI models require huge amounts of data to train, and in order to move data ...