The MarketWatch News Department was not involved in the creation of this content. Fonon, a multi-market holding company, R&D center, equipment designer and manufacturer of advanced laser material ...

ORLANDO, Fla.--(BUSINESS WIRE)--Fonon, a multi-market holding company, R&D center, equipment designer and manufacturer of advanced laser material processing systems for subtractive and additive ...

ORLANDO, Fla.--(BUSINESS WIRE)--Fonon Corporation, a multi-market holding company, R&D center, equipment designer and manufacturer of advanced laser material processing systems for subtractive and ...

Dublin, Oct. 14, 2025 (GLOBE NEWSWIRE) -- The "Silicon Carbide (SiC) Wafer Market Report by Wafer Diameter, Conductivity Type, Application, End-use, Crystal-Growth Technology, Countries and Company ...

TOKYO — In what could be a breakthrough in the chip-manufacturing process, Japan's Disco Corp. here today announced a new, automatic laser dicer tool for 300-mm fab applications. The DFL6360 from ...

Private equity firm ZMC has announced via press release that it has acquired a controlling stake in Pure Wafer, the largest semiconductor silicon solutions and services company in the United States.

Experience PI’s new piezo wafer stages, granite-based multi-axis systems for thin film metrology, air bearing stages, laser beam steering systems, and sub-nanometer precision piezo stages, backed by ...

WASHINGTON, July 17 (Reuters) - The U.S. Commerce Department said on Wednesday it planned to award Taiwan's GlobalWafers (6488.TWO), opens new tab up to $400 million in government grants to ...

The "Global Wafer Dicing Saws Market 2017-2021" report has been added to Research and Markets' offering. The global wafer dicing saws market to grow at a CAGR of 6.35% during the period 2017-2021.

The CNMIA‘s silicon branch said that it recorded a decline in polysilicon prices this week. Prices for n-type rod silicon ranged from CNY 55,000 to CNY 60,000 per ton, with an average price of CNY ...