The objective of this article is to explain the best techniques for soldering sensors manufactured by Merit Sensor using automated equipment. All profiles must be assessed and tested for best ...

In particular, a new type of packaging defect phenomenon—die-pop—is observed. Vacuum reflow process has been able to reduce the solder void size to minimum value consistently but there is an ...

In our previous issues in this series on making circuit boards, we covered placing solder paste and placing components. Now it’s time to bake our cake! There are a variety of methods for reflowing a ...

Nowadays, there are many interconnects in IC chips. One of the packaging goals is to connect an IC to the next level of subsystem circuitry (package substrates/print circuit boards). Mass reflow (MR) ...