SINGAPORE, SG / ACCESS Newswire / November 25, 2025 / Dr. Byung Joon Han, co-founder and CEO of Silicon Box attended the ...

CNW/ - Today, Carlos Leitão, Parliamentary Secretary to the Minister of Industry and Member of Parliament for Marc-Aurèle-Fortin on behalf of the Honourable Mélanie Joly, Minister of Industry and ...

CEASAX advances European semiconductor innovation through integrated front-end and advanced packaging research.

Izmo has outlined a "dual-engine" expansion strategy that uses its profitable automotive SaaS and digital businesses to fund ...

Intel CEO Lip-Bu Tan met with Malaysian Prime Minister Anwar Ibrahim on December 1, 2025, where Anwar announced an additional ...

Intel is expanding in Malaysia with a new 860 million ringgit investment, strengthening its role in the global chip supply ...

2.5D and 3D Packaging Technology: The 2.5D and 3D packaging technologies encompass various packaging techniques. In 2.5D packaging, the choice of interposer material categorizes it into Si-based, ...

TEMPE, Ariz.--(BUSINESS WIRE)-- Amkor Technology, Inc. (Nasdaq: AMKR), a leading provider of semiconductor packaging and test services, in collaboration with the Trump Administration, today announces ...

ST. PAUL, Minn., Sept. 30, 2025 /PRNewswire/ -- 3M has joined the next-generation semiconductor packaging consortium JOINT3, an effort to bring together global leaders in semiconductor materials, ...

A s part of the CHIPS for America program, the U.S. Department of Commerce (DOC) is entering negotiations to invest up to $300 million in advanced packaging research projects in Georgia, California, ...