Separating semiconductor chips from a wafer is an important step in the backend of semiconductor manufacturing. The new process from Lidrotec combines ablative laser dicing under a liquid stream with ...
The "Thin Wafer Market Report 2026" has been added to ResearchAndMarkets.com's offering.The thin wafer market is experiencing robust growth, poised to expand from $12.57 billion in 2025 to $19.45 ...
The company plans expansion in the US, with two advanced packaging facilities to be constructed near its Arizona chip fabs. Taiwan Semiconductor Manufacturing Company (TSMC) has introduced new chip ...
Semiconductor manufacturer Xanoptix (Merrimack, NH) has developed a wafer-scale process for the 3-D stacking of silicon with either GaAs or InP to make compound semiconductors. The company's Hybrid ...
Rapidus Corp., a Tokyo-based chip manufacturing startup, reportedly plans to build a fab capable of making 1.4-nanometer processors. Nikkei Asia reported the initiative today. The fab could create ...
FREMONT, Calif., July 24, 2025 (GLOBE NEWSWIRE) -- ACM Research, Inc. (“ACM”) (NASDAQ: ACMR), a leading supplier of wafer and panel processing solutions for semiconductor and advanced packaging ...
Some results have been hidden because they may be inaccessible to you
Show inaccessible results