As IC speeds continue to climb well into the gigahertz range, system designers are finding that the new obstacles they must overcome to interconnect ICs to packages and packages to printed-circuit ...

Collaboration Provides Insight on IC Packaging Trends and Delivery of State-of-the-Art IC Package Design Services “We are pleased to collaborate with Cadence, a leader in electronic design software, ...

Santa Clara, Calif. — As chip designers, Kaushik Sheth and Egino Sarto struggled to fit silicon into cost-effective packages. Now they're trying to convince other chip designers to adopt a ...

IC packaging has come into its own, where once traditional packaging was a “necessary evil,” today’s packaging can add significant value. There is an increase in functional density and flexibility by ...

When it comes to making though-silicon vias, there are no clear lines of delineation about the roles of design houses, fab facilities, and packaging houses. Yet all of these entities face a host of ...

A recently developed software tool automatically checks for design-rule violations as locations are designated for wire bonds between die and package lead frames. Known as the Post-Layout Bond Tool, ...

3D-IC technology marks a pivotal shift from scaling in two dimensions to scaling in three. By bringing compute, memory, and ...

IC packaging is a technique for shielding semiconductor equipment from ambient physical damage or degradation by wrapping them in ceramics or polymer packaging materials. There are several varieties ...

TSMC is advancing system-level innovation by improving the 3D IC design ecosystem through enhanced collaboration with foundries, customers, and partners, according to a recent blog post. The latest ...

According to projections from Towards Packaging, the global semiconductor and IC packaging materials market is set to ...

Taiwan is an important hub of the global information and communication technology (ICT) industry. The development of the ICT supply chain is supported by Taiwan's complete semiconductor ecosystem.

MEYREUIL, France & SAN JOSE, Calif.--(BUSINESS WIRE)--Presto Engineering, an ASIC design and outsourced operations provider, and Cadence Design Systems, Inc. (Nasdaq: CDNS) today announced a ...