Endicott, N.Y.— Endicott Interconnect Technologies has developed a semiconductor package marketed under the brand-name CoreEZ, which uses an organic, thin core build-up flip chip technology that ...
SEOUL, South Korea--(BUSINESS WIRE)--Samsung Electronics Co., Ltd., a world leader in advanced component solutions, today introduced a new lineup of flip chip LED packages and modules offering ...
MILPITAS, Calif. — LSI Logic Corp. here today unveiled its third-generation of organic flip-chip packages, called flxI/O, which uses an area array approach for signal I/O placement to optimize die ...
IBM finds partners for flip chip packagesNews from E-InSiteIBM is working with Amkor Technology, Advanced Semiconductor Engineering, ASAT Holdings and ASAT to develop advanced flip chip substrates and ...
Reductions in power-supply solution size and cost, which is critical to furthering development of automotive systems, also presents the challenge of reduced thermal performance. Simply put, using ...
A technical paper titled “Modelling thermomechanical degradation of moulded electronic packages using physics-based digital twin” was published by researchers at Delft University of Technology and NXP ...
The significant decreases in the size of power integrated circuits (ICs) have enabled system designers to achieve reductions in power-supply solution size and cost, which is critical to furthering the ...
Flip chip packaging represents a cutting‐edge assembly technique in which semiconductor devices are mounted upside‐down, enabling direct connection to the substrate via solder bumps. This method not ...
A surge in demand for chips is impacting the IC packaging supply chain, causing shortages of select manufacturing capacity, various package types, key components, and equipment. Spot shortages in ...
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