Description: This product is a fast curing, one-part, conductive epoxy system primarily for die attach applications. It is not pre-mixed or frozen and has an unlimited working life at room temperature ...

The 3HTND-2DA is a one-component, toughened, electrically insulating epoxy for die attaches applications. It has an exceptional electrical insulation properties and thermal conductivity, and very long ...

Venkat Nandivada, Manager of Technical Support at Master Bond Inc, talks to AZoM about die attach adhesives used in semiconductor assembly. Beyond their ability to form a tight bond between die and ...

The Master Bond EP3HTSDA-1 is a fast curing, one part, conductive epoxy system primarily for die attach applications. It is not premixed and frozen and has an unlimited working life at room ...

Master Bond's advanced die-attach adhesives are increasingly accepted for the most demanding microelectronic semiconductor packaging as well as for chips-on-board assemblies. Both one component heat ...

High-power semiconductor applications currently represent one of the highest growth sectors of any semiconductor technology, specifically because many of the key applications are driven by the ...