ISMANING, Germany--(BUSINESS WIRE)--Kontron, a leading global provider of IoT/Embedded Computer Technology (ECT), announces the development of a COM-HPC Mini module based on the COM-HPC 1.2 ...
The COMX-A300 leverages Intel® Core™ Ultra architecture to redefine high-performance computing in a modular form factor. Supporting up to 96GB of DDR5 (6400MT/s) memory for ultra-fast throughput, it ...
The PICMG consortium has ratified the COM-HPC specification for high-performance computing modules. It defines five module sizes to deliver edge server performance for small, rugged data centres and ...
PICMG’s COM-HPC committee has finalized the pinout and dimension definitions for the COM-HPC Mini form factor, announced in June 2022. The consortium for the development of open embedded computing ...
TAIPEI, Nov. 4, 2025 /PRNewswire/ -- ARBOR Technology, a leading provider of embedded and industrial computing solutions, proudly announces the COMX-A300 Edge AI Computing Module. Built on the ...
New COM specification will meet the increasing server-level requirements of high-end edge-computing applications. Things are really starting to heat up with regard to the amount of computing power ...
SAN JOSE, Aug. 15, 2023 — The ADLINK COM-HPC-cRLS Client type Size C module based on 13th Gen Intel Core processor is available for order with: o up to 13th Gen Intel Core i9 processor, 16 Performance ...
New Heights in Edge AI: Significantly Faster NPU and GPU Performance ...
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