Tessera Inc. Friday will unveil a new ultra-thin tri-fold stacked chip-scale package (CSP) co-developed with Intel Corp. for that firm's highest-density flash memory. Bruce McWilliams, president and ...
Nordic Semiconductor has introduced the nRF54LV10A, a Bluetooth LE system-on-chip designed for low-voltage, space-constrained ...
Sunnyvale, Calif.-based Actel Corp. today released a new type of chip-scale package for its eX family of field programmable gate arrays (FPGAs) use in portable devices. According to Actel, the package ...
A fully qualified, high-performance, low-power and small-form-factor wafer-level chip-scale package (W-CSP) developed by Oki Semiconductor satisfies a wide range of ASIC design demands. Targeting chip ...
SEOUL, South Korea--(BUSINESS WIRE)--Samsung Electronics Co., Ltd., a world leader in advanced component solutions, announced today that it has introduced “Fx-CSP,” a line-up of LED packages which ...
Staccato Communications says its Ripcord wafer chip-scale package offers the smallest form factor of any Certified Wireless USB-based solution available, reducing the space needed to implement an ...
Packaging houses are readying their next-generation advanced IC packages, paving the way toward new and innovative system-level chip designs. It’s a confusing landscape with a plethora of buzzwords ...
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