In another step towards driving the maturity of 3D IC integration, SEMATECH's 3D Interconnect program announced today the completion of its 300mm 3D IC pilot line, operating at the College of ...

FREMONT, Calif., Sept. 23, 2021 (GLOBE NEWSWIRE) -- ACM Research, Inc. (ACM) (NASDAQ: ACMR), a leading supplier of wafer processing solutions for semiconductor and advanced wafer-level packaging (WLP) ...

Aledia, a French startup pioneering a disruptive technology for microLED displays, today announced it has manufactured the world’s first microLED chips produced on 300mm (12in) silicon wafers. The ...

What just happened? Texas Instruments announced it will build 300mm wafer fabrication plants in Sherman, Texas, to tackle the increasing demand for semiconductors worldwide. Construction of the first ...

Share on Facebook (opens in a new window) Share on X (opens in a new window) Share on Reddit (opens in a new window) Share on Hacker News (opens in a new window) Share on Flipboard (opens in a new ...

In this article we look at the Lam Research Coronus DX edge bevel deposition announcement to increase yield of semiconductor wafers after complex processes, such as during the creation of 3D NAND.

ST. PAUL, Minn.--(BUSINESS WIRE)--3M, a leading supplier of advanced materials to the semiconductor packaging industry, today announced the opening of the company’s application laboratory in Yangmei, ...